Wavelength-division multiplexing for use in multi-chip systems
AssigneeSun Microsystems, Inc.
InventorsBrian W. O'Krafka, Ashok V. Krishnamoorthy, John E. Cunningham, Xuehze Zheng, Ilya A. Sharapov, Ronald Ho
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AssigneeSun Microsystems, Inc.
InventorsBrian W. O'Krafka, Ashok V. Krishnamoorthy, John E. Cunningham, Xuehze Zheng, Ilya A. Sharapov, Ronald Ho
Estimating the term…
Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).
A system, comprising:
(canceled)
A method for communicating data signals in an array of CMs that includes N subsets of CMs, each of which includes M CMs, the method comprising:
A computer system, comprising:
Dependencies are inferred from the claim text.