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US 2012/0224327 A1Published application
Integrated Circuits Having Interconnects and Heat Dissipators Based on Nanostructures
AssigneeSmoltek AB
InventorMohammad Shafiqul Kabir
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Abstract
The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.
Claims7
A heat dissipator, comprising:
- a conductive substrate;
- and
- a plurality of nanostructures supported by said conductive substrate, said plurality of nanostructures being at least partly embedded in an insulator,
- wherein each of said nanostructures comprises:
- a plurality of intermediate layers on the conductive substrate, wherein at least two of the plurality of intermediate layers are interdiffused, and wherein material of the at least two of the plurality of intermediate layers that are interdiffused is present in the nanostructure.
2 more elements
Dependencies are inferred from the claim text.