Heat dissipating device

A heat dissipating device for dissipating heat from a heat radiation element mounted on a circuit board, the circuit board having a mounting surface and at least one mounting hole defined in the mounting surface, the heat dissipating device comprising:

• a heat sink for being arranged on the heat radiation element;
• at least one support arm attached to the heat sink, each of the at least one support arm defining a groove and a first slot communicating with the groove;
• at least one securing unit, each of the at least one securing unit comprising a sliding arm and a fixing arm connected to the sliding arm, the sliding arm defining a receiving recess and a second slot communicating with the receiving recess, the fixing arm defining a third slot, the sliding arm being slidably engaged in the groove of a corresponding one of the at least one support arm, and the sliding arm being configured for moving the fixing arm toward or away from the heat sink to align the third slot of the fixing arm with a corresponding one of the at least one mounting hole, with the first slot of the corresponding support arm communicating with the second slot of the sliding arm;
• at least one first fastener, each first fastener configured for being received in the third slot of a corresponding fixing arm and a corresponding mounting hole to fix the corresponding fixing arm on the circuit board;
• and
• at least one second fastener, each second fastener configured for being received in the first slot of a corresponding supporting arm and the second slot of a corresponding sliding arm to attach the corresponding sliding arm to the corresponding support arm.