Method of circuit layout by photosensitive environment-friendly ink

Abstract

A method of circuit layout by photosensitive environment-friendly ink, which is used in a printed circuit board having a copper foil layer. The method comprises: providing photosensitive environment-friendly ink; disposing a circuit layout pattern, and injecting the photosensitive environment-friendly ink on the copper foil layer according to the circuit layout pattern to form the printed circuit board having the circuit layout pattern thereon; exposing the printed circuit board under light to have the photosensitive environment-friendly ink reacted with ultraviolet light in the light; and copper cleaning and alkaline cleaning the copper foil layer to expose the circuit layout pattern corresponding to the photosensitive environment-friendly ink on the printed circuit board. The invention can be used to achieve reducing steps in the conventional printed circuit board manufacturing process, reduced usage of chemical materials, simplified transfer of manufacturing process, optimization of wirings in the circuit layout, and low cost manufacture.

Dependencies are inferred from the claim text.