IC Thermal Management System
AssigneeTDK-Lambda Corporation
InventorGordon K. Y. Lee
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Abstract
The present invention provides a non-intrusive method for dissipating heat from open-frame DC-DC power converters where bottom side components are exposed. A thermal interface material is placed between the motherboard to which the power converter is soldered and power dissipating and temperature sensitive components on the bottom of the power converter. The thermal interface material fills the gap between the power converter components and the motherboard, thereby providing a heat conductive path for dissipating heat from the power converter to the motherboard.
Claims8
A method of dissipating heat from a dc-dc power converter, the method comprising the steps of:
- (a) placing a thermal interface material on the bottom of the power converter;
- and
- (b) coupling the power converter to a motherboard, wherein the thermal interface material fills space between the power converter and the motherboard and thereby provides a heat conductive path that dissipates heat from the power converter directly to the motherboard.
Dependencies are inferred from the claim text.