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US 2012/0084478 A1Published application
Stacked die with vertically-aligned conductors and methods for making the same
AssigneeApple Inc.
InventorsNir J. Wakrat, Nick Seroff, Anthony Fai
Life of this patent
Estimating the term…
Abstract
Stacked die having vertically-aligned conductors and methods for making the same are disclosed for providing a non-volatile memory, such as flash memory (e.g., NAND flash memory), for use in an electronic device.
Claims15
A non-volatile memory package, comprising:
- a plurality of dies each having a rectangular shape including a length, a width, a top surface, a bottom surface, and edges, the rectangular shape is divided into four quadrants, and each die is constructed to have bus interface connectors extending from a predetermined one of the quadrants such that each interface connector extends beyond at least one edge of the predetermined quadrant,
- wherein the plurality of dies are arranged in a vertical stack, the vertical stack having multiple non-overlapping zones, and each die is oriented such that the predetermined quadrant for each die is positioned in a different one of the non-overlapping zone;
- controller circuitry mounted on the top surface of a top die in the vertical stack;
- and
- a plurality of conductors that interface the controller circuitry to the bus interface connectors.
2 more elements
A silicon package, comprising:
- a plurality of die arranged in a vertical stack, each die having bus interface connectors protruding away from the die;
- controller circuitry mounted to a surface of one of the die;
- and
- conductors that electrically couple the controller circuitry to the interface bus connectors, wherein the conductors are mounted external to the plurality of die.
1 more element
A method for making a stacked non-volatile die package, the method comprising:
- providing a plurality of NVM dies, each die having a substantially similar construction that includes interface bus connectors that extend away from at least one edge of the die;
- orienting the plurality of dies such that the interface bus connectors for any one die are positioned in a zone that does not overlap with the interface bus connectors of the other dies;
- stacking the oriented plurality of dies;
- mounting control circuitry to a surface of one of the die;
- and
- electrically coupling the control circuitry to the interface bus connectors with a plurality of conductors.
3 more elements
A method for making a stacked die package, the method comprising:
- providing a plurality of dies, each die constructed to have similar physical dimensions and include interface bus connectors that extend away from a predetermined portion of the die, wherein the predetermined portion is different for each die;
- stacking the plurality of dies;
- mounting control circuitry to a surface of one of the die;
- and
- electrically coupling the control circuitry to the interface bus connectors with a plurality of conductors.
2 more elements
Dependencies are inferred from the claim text.