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US 2012/0075821 A1Published application
Integrated circuit packaging system with a shield and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorReza Argenty Pagaila
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
- mounting a first integrated circuit over the substrate;
- forming an encapsulant around the first integrated circuit and over the substrate;
- and
- forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.
2 more elements
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
- mounting a first integrated circuit over the substrate;
- forming an encapsulant around the first integrated circuit and over the substrate with openings;
- forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure;
- and
- patterning the shield structure and the vertical interconnect structure to form a shield and a vertical interconnect.
3 more elements
An integrated circuit packaging system comprising:
- a substrate;
- a first integrated circuit over the substrate;
- an encapsulant around the first integrated circuit and over the substrate with openings that expose a ground ring pad and a conductive pad;
- and
- a shield within and over the encapsulant in contact with the ground ring pad and a vertical interconnect within the encapsulant in contact with the conductive pad.
2 more elements
Dependencies are inferred from the claim text.