Electronic package structure
AssigneeCyntec Co., Ltd.
InventorsHan-Hsiang LEE, Yi-Cheng Lin, Pei-Chun Hung, Bau-Ru Lu, Da-Jung Chen, Jeng-Jen Li
Life of this patent
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Abstract
An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.
Claims20
An electronic package structure comprising:
- a substrate including a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate;
- a first electronic element disposed on the heat-dissipating plate and coupled to the circuit board;
- and
- a second electronic element disposed on the circuit board and coupled to the circuit board.
An electronic package structure of a direct current to direct current converter, the electronic package structure comprising:
- a substrate including:
- a printed circuit board having a circuit layout and a plurality of conductive nodes, wherein
- the conductive nodes are coupled to the circuit layout and adapted for being coupled to an external electronic device, and
- the printed circuit board defines an opening extending from a first surface of the printed circuit board to a second surface of the printed circuit board opposite the first surface;
- and
- a lead frame disposed on the second surface and fitted within the printed circuit board so that the lead frame does not protrude through the second surface of the printed circuit board, wherein and the location of the lead frame corresponds to that of the opening so that the lead frame covers at least a part of the opening;
- a first electronic element disposed on the lead frame, located in the opening and coupled to the circuit layout of the printed circuit board;
- and
- a second electronic element disposed on the printed circuit board and coupled to the circuit layout of the circuit board, wherein the amount of heat produced by the first electronic element is larger than the amount of heat produced by the second electronic element.
Dependencies are inferred from the claim text.