Tool Management Method of Die Bonder and Die Bonder

A tool management method of a die bonder in which a part of a preform head by which a printed substrate is coated with a paste to bond a die, a part of a bonding head which picks up the die from a semiconductor wafer to be supplied to the printed substrate, and a part of a push-up unit which pushes up the die from the lower side when the bonding head picks up the die are replaceable as tools, the method comprising:

• (1) a step of attaching an RFID tag to any one of the tool of the preform head, the tool of the bonding head, and the tool of the push-up unit;
• (2) a step of storing, into the RFID tag, information related to each tool to which the RFID tag is attached;
• (3) a step of mounting any one of the tool of the preform head, the tool of the bonding head, and the tool of the push-up unit;
• (4) a step of holding, in a first memory, information of the processing-target die of each tool that is input by an input device;
• (5) a step of reading the information stored in the RFID tag attached to each tool by an RFID reader/writer that reads and writes data from/into the RFID tag using radio waves;
• (6) a step of comparing, by an operational device, the information of the processing-target die of each tool that is held in the first memory with the information related to each tool that is stored in the RFID tag attached to each tool;
• and
• (7) a step of displaying, if the comparison result in the step (6) shows that the both do not match each other, a determination result related to mounting of each tool on a display device by the operational device.