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US 2012/0075050 A1Published application
Circuit device
AssigneeRenesas Electronics Corporation
InventorsMasaya KAWANO, Yasutaka NAKASHIBA
Life of this patent
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Abstract
The device includes a first inductor, a first insulating layer, a second inductor, and a third inductor. The first inductor includes a helical conductive pattern. The second inductor is located in a region overlapping the first inductor through the first insulating layer. The second inductor includes a helical conductive pattern. The third inductor is connected in series to the second inductor, and includes a helical conductive pattern.
Claims16
A device comprising:
- a first inductor including a first helical conductive pattern;
- a first insulating layer provided over or under said first inductor;
- a second inductor, located in a region overlapping with said first inductor through said first insulating layer and including a second helical conductive pattern;
- and
- a third inductor, connected in series to said second inductor and including a third helical conductive pattern.
2 more elements
Dependencies are inferred from the claim text.