Semiconductor Component and Method
AssigneeSemiconductor Components Industries, LLC
InventorsDavid D. Marreiro, Sudhama C. Shastri, Stefan Gueorguiev
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Abstract
A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes one or more transient voltage suppression structures. In an embodiment, the semiconductor component may include an over-voltage detection circuit, an over-current detection circuit, an over-temperature detection circuit, an ESD protection circuit, or combinations of these circuits.
Claims30
A method for protecting a first circuit element from a stress condition, comprising:
- mounting the first circuit element to a support;
- mounting at least one protection device to the support;
- coupling the at least one protection device to the first circuit element;
- and
- inactivating the first circuit element in response to the stress condition.
A module including circuitry for protecting against a stress condition, comprising:
- a first circuit element mounted to a support;
- and
- at least one protection device mounted to the support, the at least one protection device coupled to the first circuit element and capable of inactivating the first circuit element in response to the stress condition.
Dependencies are inferred from the claim text.