Piezoelectric Device

A piezoelectric device, comprising:

• a piezoelectric frame having a piezoelectric vibrating piece that vibrates when electrically energized and an outer frame including a first principal surface and a second principal surface formed as to surround the piezoelectric vibrating piece and;
• a package lid having a first peripheral surface that is bonded to the first principal surface of the outer frame of the piezoelectric frame;
• and
• a package base having a second peripheral surface that is bonded to the second principal surface of the outer frame of the piezoelectric frame;
• wherein at least one of the first principal surface of the outer frame or the first peripheral surface of the package lid, and at least one of the second principal surface of the outer frame or the second peripheral surface of the package base has a rough surface;
• a metal film is formed on the rough surface;
• and
• the package lid and the outer frame, and the outer frame and the package base are bonded using a sealing material formed between metal films formed at least one of the package lid, the package base or the outer flame.

A method for manufacturing a piezoelectric device, comprising:

• a first preparation step of preparing a piezoelectric vibrating piece that vibrates when electrically energized;
• a second preparation step of preparing a lid wafer, including a plurality of package lids each having a first peripheral surface formed circumferentially on a plane in a predetermined width;
• a first metal film forming step for forming a first metal film on a rough surface formed on the lid wafer;
• a third preparation step of preparing a base wafer, including a plurality of package bases each having a second peripheral surface and a recess portion recessed from the second peripheral surface;
• a second metal film forming step for forming a second metal film on a rough surface formed on the base wafer;
• a mounting step for mounting the piezoelectric vibrating piece onto the package base using an electrically conductive adhesive;
• and
• a bonding step for bonding the lid wafer and the base wafer using a sealing material between said respective first and second metal films.