Passive impedance matching
AssigneeHewlett-Packard Development Company, L.P.
InventorsAndrew James Phelan, Michael Stearns, Minh H. Nguyen, Chanh V. Hua, Raghavan V. Venugopal, David Paul Mohr
Life of this patent
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Abstract
Methods, devices, and systems for passive impedance matching are provided. An example of a method of passive impedance matching includes providing a substantially equivalent impedance between a source and a load for three single-phase power supplies via a geometry of a busbar. The busbar can be coupled to the three-phase power supplies as the source and coupled to a plurality of electronic machines as the load.
Claims15
A method of passive impedance matching, comprising:
- providing a substantially equivalent impedance between a source and a load for three single-phase power supplies via a geometry of a busbar;
- coupling the busbar to the three single-phase power supplies as the source;
- and
- coupling the busbar to a plurality of electronic machines as the load.
A busbar for passive impedance matching, comprising:
- a first leg connected between a common tie point and a first terminal;
- a second leg connected between the common tie point and a second terminal;
- and
- a third leg connected between the common tie point and a third terminal;
- wherein a geometry of each of the first, the second, and the third legs provides a substantially equivalent impedance for each of the first, the second, and the third legs between the respective terminals and the common tie point.
An electronic system for passive impedance matching, comprising:
- a tray backplane, including a first and a second electrical interconnect coupled to a plurality of nodes;
- a power backplane including three power supply inputs and three ground returns;
- and
- a first busbar coupled between the tray backplane and the power backplane, wherein the first busbar includes:
- three first terminals connected to the three power supply inputs;
- a first common tie point coupled to the first electrical interconnect;
- and
- three first legs, each first leg running from one of the three first terminals to the first common tie point;
- wherein a geometry of each of the three first legs provides a substantially equivalent impedance between the three power supply inputs and the first electrical interconnect;
- a second busbar coupled between the tray backplane and the power backplane, wherein the second busbar includes:
- three second terminals connected to the three ground returns;
- a second common tie point coupled to the second electrical interconnect;
- and
- three second legs, each second leg running from one of the three second terminals to the second common tie point;
- wherein a geometry of each of the three second legs provides a substantially equivalent impedance between the three ground returns and the second electrical interconnect.
Dependencies are inferred from the claim text.