Flexible underfill compositions for enhanced reliability
AssigneeIntel Corporation
InventorsDingying Xu, Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket Raravikar, Gregory S. Constable
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AssigneeIntel Corporation
InventorsDingying Xu, Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket Raravikar, Gregory S. Constable
Estimating the term…
Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.
An underfill composition comprising:
An underfill composition comprising:
An assembly comprising:
Dependencies are inferred from the claim text.