Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsJeongOh Ha, Heungkyu Kwon, YunSeok Choi, Jong-Won Lee
Life of this patent
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Abstract
A semiconductor package includes a first substrate on which a first semiconductor chip is mounted, a second substrate spaced apart from the first substrate and on which a second semiconductor chip is mounted, first pads disposed on the first substrate, second pads disposed on the second substrate to be opposite to the first pads, and connection patterns electrically connecting the opposite first and second pads to each other, respectively. The first pads are disposed asymmetrically with respect to the central axis of the first substrate.
Claims20
A semiconductor package, comprising:
- a first substrate;
- a first semiconductor chip mounted on the first substrate;
- a second substrate spaced apart from the first substrate;
- a second semiconductor chip mounted on the second substrate;
- first pads disposed on the first substrate;
- second pads disposed on the second substrate to be opposite to the first pads;
- and
- connection patterns electrically connecting the opposite first and second pads to each other, respectively,
- wherein the first pads are disposed asymmetrically with respect to the central axis of the first substrate.
A semiconductor package, comprising:
- a substrate;
- a semiconductor chip mounted on the substrate;
- and
- a plurality of connection patterns disposed on a first surface of the substrate, the connection patterns being disposed asymmetrically with respect to the central axis of the substrate.
A semiconductor package, comprising:
- a first substrate;
- a first semiconductor chip mounted on the first substrate;
- a second substrate spaced apart from the first substrate;
- a second semiconductor chip mounted on the second substrate;
- first pads disposed on the first substrate;
- second pads disposed on the second substrate to be opposite to the first pads;
- and
- connection patterns electrically connecting the opposite first and second pads to each other, respectively, wherein:
- the first pads are disposed asymmetrically with respect to the central axis of the first substrate, and
- first pads transmitting and receiving the same signal are collectively disposed in one region of the first substrate.
Dependencies are inferred from the claim text.