Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby

A method of forming a package structure comprising;

• attaching a die to a carrier material;
• forming a mold compound over the die;
• removing a portion of the mold to expose pads on a first side and on a second side of the die;
• forming dielectric material on first and second surfaces of the mold compound;
• forming a coreless substrate by building up layers on the dielectric material disposed on the first and second surfaces of the mold compound.

A structure comprising:

• a die embedded in a coreless substrate, wherein a mold compound surrounds the die, and wherein the die comprises TSV connections on a first side and C4 pads on a second side of the die;
• a dielectric material on a first side and on a second side of the mold compound;
• and
• interconnect structures coupled to the C4 pads and to the TSV pads.

A structure comprising:

• a first die embedded in a coreless substrate;
• a first dielectric material adjacent the first die;
• a second die embedded in the coreless substrate, wherein the second die is disposed above the first die;
• a second dielectric material adjacent the second die;
• interconnect structures connecting the first die to solder connections on an outer portion of the coreless substrate, wherein the coreless substrate does not comprise PoP lands to connect the second die to the coreless package.