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US 2012/0074579 A1Published application
Semiconductor chip with reinforcing through-silicon-vias
AssigneesAdvanced Micro Devices, Inc., ATI Technologies ULC
InventorsMichael Z. Su, Gamal Refai-Ahmed, Bryan Black
Life of this patent
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Abstract
A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip opposite the first side.
Claims29
A method of manufacturing, comprising:
- connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip;
- and
- connecting a second end of the first thu-silicon-via to a second die seal proximate a second side of the first semiconductor chip opposite the first side.
A method of manufacturing, comprising:
- forming a first through-silicon-via in a first semiconductor chip, the first through-silicon-via including a first end and a second end;
- forming a first die seal ohmic contact with the first end of the first through-silicon-via;
- and
- forming a second die seal in ohmic contact with the second end of the first through-silicon-via.
1 more element
An apparatus, comprising:
- a first semiconductor chip having a first side and a second and opposite side and including a first die seal proximate the first side and a second die seal proximate the second side;
- and
- a first through-silicon-via having a first end connected to the first die seal and a second end connected to the second die seal.
An apparatus, comprising:
- a first semiconductor chip having a first side and a second and opposite side and including a first die seal proximate the first side and a second die seal proximate the second side;
- a first through-silicon-via having a first end connected to the first die seal and a second end connected to the second die seal;
- and
- wherein the apparatus is embodied in instructions stored in a computer readable medium.
1 more element
Dependencies are inferred from the claim text.