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US 2012/0074569 A1Published application
Semiconductor device
AssigneePanasonic Corporation
InventorKouji OOMORI
Life of this patent
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Abstract
A semiconductor device includes a substrate having external connection terminals, and a semiconductor chip mounted over a semiconductor-chip mounting portion of the substrate. The external connection terminals are formed by sequentially forming an electroless nickel plating layer, an electroless gold plating layer, and an electrolytic gold plating layer on a terminal portion formed on a surface of the substrate.
Claims22
1-5. (canceled)
A semiconductor device, comprising:
- a substrate having a top surface, a bottom surface opposite to the top surface, a first external connection terminal, at least two second external connection terminals, and a first wiring pattern;
- and
- a semiconductor chip provided on the top surface;
- wherein the top surface comprises a chip area in the middle of the top surface and a peripheral area outside the chip area, and said chip area and said peripheral area do not overlap with one another,
- the semiconductor chip is disposed in the chip area,
- the first external connection terminal is formed in the peripheral area,
- the at least two second external connection terminals are formed in the peripheral area outside the first external connection terminal,
- the first wiring pattern extends from the first external connection terminal to an outer periphery of the top surface, and
- the first wiring pattern passes through a place between adjacent ones of the at least two second external connection terminals.
6 more elements
Dependencies are inferred from the claim text.