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US 2012/0074564 A1Published application
Semiconductor device and manufacturing method of the same
AssigneeCasio Computer Co., Ltd.
InventorJunji SHIOTA
Life of this patent
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Abstract
A semiconductor device comprises a semiconductor substrate having a connection pad, an external connection electrode provided on the semiconductor substrate to be connected to the connection pad, and a sealing film provided to cover the external connection electrode, wherein an opening is provided in the sealing film to expose a center of the upper surface of the external connection electrode, and the sealing film is provided to cover an outer peripheral part of the upper surface of the external connection electrode.
Claims16
A semiconductor device comprising:
- a semiconductor substrate having a connection pad;
- an external connection electrode provided on the semiconductor substrate to be connected to the connection pad;
- and
- a sealing film provided to cover the external connection electrode,
- wherein an opening is provided in the sealing film to expose a center of the upper surface of the external connection electrode, and the sealing film is provided to cover an outer peripheral part of the upper surface of the external connection electrode.
2 more elements
A semiconductor device manufacturing method comprising:
- forming a sealing film to cover a peripheral side surface and an upper surface of an external connection electrode which is formed on a semiconductor substrate to be connected to a connection pad of the semiconductor substrate;
- and
- forming an opening in the sealing film,
- wherein the opening is formed in the sealing film so that the opening exposes a center of the upper surface of the external connection electrode and so that the sealing film covers an outer peripheral part of the upper surface of the external connection electrode.
1 more element
Dependencies are inferred from the claim text.