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US 2012/0074558 A1Published application
Circuit Board Packaged with Die through Surface Mount Technology
AssigneeMao Bang Electronic Co., Ltd.
InventorsHsuan Yu LU, Tse Ming CHU, Kuei-Wu CHU
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Abstract
A package of a circuit board and a die are packed through surface mount technology (SMT). The shortest circuit is formed with at a low cost. Thus, the package can work in high speed and high frequency applications.
Claims6
A circuit board packaged with a die through surface mount technology (SMT), comprising:
- a circuit board, said circuit board having a circuit layout layer on a first surface of said circuit board;
- and
- a die, said die being connected with said circuit board on said first surface of said circuit board, said die having an input/output (I/O) point on a surface of said die, said die having a connecting wire layer on said surface of said die having said I/O point, said connecting wire layer having a plurality of pads, said pads being connected with said circuit layout layer,
- wherein said die is packaged on said circuit layout layer of said circuit board through SMT with coordination of said pads.
1 more element
Dependencies are inferred from the claim text.