Integrated Circuit Package Lid Configured For Package Coplanarity

An apparatus comprising:

• a packaging substrate including an upper side and an opposing underside;
• an integrated circuit coupled to the upper side of the packaging substrate;
• an array of contacts coupled to the underside of the packaging substrate for electrically coupling the integrated circuit to a circuit board;
• a lid including opposing side portions and corner areas, the side portions coupled to the upper side of the packaging substrate, and each of the corner areas including a gap exposing a correspondingly aligned portion of the packaging substrate.

A method comprising:

• providing a lid for attaching to a semiconductor die packaging substrate, the lid having opposing side portions and corner areas;
• removing a portion of each of the corner areas, thereby forming a gap in each of the corner areas;
• and
• attaching the side portions of the lid to the packaging substrate so that the gap in each of the corner areas exposes a correspondingly aligned portion of the packaging substrate.