Semiconductor power module and method of manufacturing the same
AssigneeRohm Co., Ltd.
InventorToshio HANADA
Life of this patent
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Abstract
A semiconductor power module according to the present invention includes a base member, a semiconductor power device having a surface and a rear surface with the rear surface bonded to the base member, a metal block, having a surface and a rear surface with the rear surface bonded to the surface of the semiconductor power device, uprighted from the surface of the semiconductor power device in a direction separating from the base member and employed as a wiring member for the semiconductor power device, and an external terminal bonded to the surface of the metal block for supplying power to the semiconductor power device through the metal block.
Claims16
A semiconductor power module comprising:
- a base member;
- a semiconductor power device having a surface and a rear surface with the rear surface bonded to the base member;
- a metal block, having a surface and a rear surface with the rear surface bonded to the surface of the semiconductor power device, uprighted from the surface of the semiconductor power device in a direction separating from the base member and employed as a wiring member for the semiconductor power device;
- and
- an external terminal bonded to the surface of the metal block for supplying power to the semiconductor power device through the metal block.
A method of manufacturing a semiconductor power module comprising the steps of:
- bonding a rear surface of a semiconductor power device having a surface and the rear surface to a base member;
- bonding a rear surface of a metal block, having a surface and the rear surface, employed as a wiring member for the semiconductor power device to the surface of the semiconductor power device after bonding the base member and the semiconductor power device to each other;
- performing preliminary soldering on an external terminal for supplying power to the semiconductor power device;
- and
- bonding the external terminal and the metal block to each other by bringing the metal block into contact with a portion of the external terminal subjected to the preliminary soldering and heating the external terminal.
Dependencies are inferred from the claim text.