Bond ring for a first and second substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Wen Cheng, Hsueh-An Yang
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Abstract
The present disclosure provides a device having a plurality of bonded substrates. The substrates are bonded by a first bond ring and a second bond ring. In an embodiment, the first bond ring is a eutectic bond and the second bond ring is at least one of an organic material and a eutectic bond. The second bond ring encircles the first bond ring. The first bond ring provides a hermetic region of the device. In a further embodiment, a plurality of wafers are bonded which include a third bond ring disposed at the periphery of the wafers.
Claims20
A device, comprising:
- a first substrate including a MEMS device;
- and
- a second substrate bonded to the first substrate, wherein the second substrate is bonded to the first substrate at a first bond ring and a second bond ring.
A device, comprising:
- a first wafer;
- and
- a second wafer, wherein the first wafer and the second wafer are bonded together using at least one bond ring, wherein the at least one bond ring is disposed on the peripheral region on the first wafer and the second wafer.
A method, comprising:
- providing a first substrate, wherein the first substrate includes a MEMS device;
- providing a second substrate;
- bonding the first substrate to the second substrate, wherein the bonding includes:
- forming a first bond ring;
- and
- forming a second bond ring, wherein the second bond ring encircles the first bond ring.
Dependencies are inferred from the claim text.