Circuit device and method for manufacturing the same

A circuit device comprising:

• a first substrate having a first side and a second side;
• a plurality of first leads disposed along the first side of the first substrate and each comprising a lead portion and an island portion which is attached to an upper surface of the first substrate;
• a plurality of first circuit elements mounted on the island portions of the first leads;
• a second substrate disposed above and overlapping the first substrate;
• a plurality of second lead disposed along the second side of the first substrate;
• a plurality of second circuit elements mounted on the second substrate so as to be electrically connected to corresponding first circuit elements through the second leads;
• and
• an encapsulating resin covering the first substrate, the second substrate, the first circuit elements, the second circuit elements and the island portions, the lead portions of the first leads not being covered by the encapsulating resin.

A method of manufacturing a circuit device, comprising:

• providing a lead frame comprising a plurality of leads, some of the leads comprising respective island portions;
• mounting a first circuit element on an upper surface of each of the island portions;
• attaching lower surfaces of the island portions to an upper surface of a first substrate;
• placing a second substrate on which second circuit elements are mounted over the first substrate so that the second substrate is mechanically supported by the leads;
• and
• encapsulating the first substrate, the first circuit elements, the, second substrate and the second circuit elements by a resin.