Semiconductor device with exposed pad
AssigneeFreescale Semiconductor, Inc.
InventorsKai Yun YOW, Poh Leng Eu
Life of this patent
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Abstract
A semiconductor device has a die attached to a die pad and electrically connected to lead fingers. The die, a top surface of the die pad, and a first portion of the lead fingers are covered with a mold compound. A second portion of the lead fingers project from the mold compound and allow for external electrical connection to the die. The mold compound around the die and lead fingers is extended such that a cavity is formed below the die pad. The die pad is exposed via the cavity. A heat sink may be inserted into the cavity and attached to the bottom surface of the die pad.
Claims12
A semiconductor device, comprising:
- an integrated circuit (IC) die;
- a lead frame having a die pad and a plurality of lead fingers disposed on at least two opposing sides of the die pad, wherein the IC die is attached to a top surface of the die pad and is electrically connected to the plurality of lead fingers;
- and
- a mold compound covering the IC die, a top surface of the die pad, and a first portion of the lead fingers, wherein a second portion of the lead fingers is exposed on two opposing sides of the semiconductor device, said exposed portions allowing for external electrical connection to the IC die;
- and
- wherein the mold compound includes a cavity below the die pad such that a bottom surface of the die pad is exposed.
A semiconductor device, comprising:
- an integrated circuit (IC) die;
- a lead frame having a die pad and a plurality of lead fingers disposed on at least two opposing sides of the die pad, wherein the IC die is attached to a top surface of the die pad and is electrically connected to the plurality of lead fingers;
- and
- a mold compound covering the IC die, a top surface of the die pad, and a first portion of the lead fingers, wherein a second portion of the lead fingers is exposed on two opposing sides of the semiconductor device, said exposed portions allowing for external electrical connection to the IC die;
- and
- wherein the mold compound includes a cavity below the die pad such that a bottom surface of the die pad is exposed, wherein the cavity has a depth of about 0.2 to 0.5 mM.
Dependencies are inferred from the claim text.