Integrated circuit packaging system with interlock and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• forming a package paddle;
• forming a lead adjacent the package paddle, the lead having a lead overhang protruding from a lead non-horizontal side and a lead ridge protruding from the lead non-horizontal side;
• mounting an integrated circuit over the package paddle;
• connecting an electrical connector to the lead and the integrated circuit;
• and
• forming an encapsulation over the integrated circuit, the lead, and the package paddle, the encapsulation under the lead overhang and exposing a lead lower non-horizontal side of the lead.

An integrated circuit packaging system comprising:

• a package paddle;
• a lead adjacent the package paddle, the lead having a lead overhang protruding from a lead non-horizontal side and a lead ridge protruding from the lead non-horizontal side;
• an integrated circuit over the package paddle;
• an electrical connector connected to the lead and the integrated circuit;
• and
• an encapsulation over the integrated circuit, the lead, and the package paddle, the encapsulation under the lead overhang.