Integrated circuit packaging system with lead encapsulation and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Reza Argenty Pagaila, Linda Pei Ee Chua, Arnel Senosa Trasporto
Life of this patent
Estimating the term…
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming a package paddle;
- forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side;
- mounting an integrated circuit over the package paddle;
- connecting an electrical connector to the lead and the integrated circuit;
- and
- forming a fill layer within the hole.
A method of manufacture of an integrated circuit packaging system comprising:
- forming a package paddle;
- forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side;
- attaching an attach layer to the package paddle;
- mounting an integrated circuit over the package paddle with the attach layer attached to the integrated circuit;
- connecting an electrical connector to the lead and the integrated circuit;
- and
- forming a fill layer within the hole.
An integrated circuit packaging system comprising:
- a package paddle;
- a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side;
- an integrated circuit over the package paddle;
- an electrical connector connected to the lead and the integrated circuit;
- and
- a fill layer within the hole.
Dependencies are inferred from the claim text.