Package apparatus of power semiconductor device

A package apparatus of a power semiconductor device for packaging a power semiconductor device that includes a substrate formed in a square shape, a mold part molded on the substrate in a square thick plate-like shape, and a plurality of electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length, the package apparatus comprising:

• a holding unit that has a plurality of insertion slots and is configured to be capable of holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction generally perpendicular to an extending direction of the electrode terminal, edges of the opening being formed so as to make contact with the mold part and the substrate;
• and
• a container box that contains the holding unit,
• the plurality of insertion slots being provided to the holding unit so that an interval between the plurality of insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.