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US 2012/0074540 A1Published application
Semiconductor chip package
AssigneeSamsung Electronics Co., Ltd.
InventorsKyong-Soon CHO, Chang-Su KIM, Kwan-Jai LEE, Kyoung-Sei CHOI, Jae-Hyok KO, Keung-Beum Kim
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Abstract
A structure of a semiconductor chip package is provided. The semiconductor chip package includes: a substrate; a semiconductor chip mounted on a first surface of the substrate; a plurality of electrode pads on a second surface, different from the first surface, of the substrate; and an electrostatic discharge protection pad overlapping a portion of a first electrode pad and a portion of a second electrode pad among the plurality of electrode pads.
Claims20
A semiconductor chip package comprising:
- a substrate;
- a semiconductor chip mounted on a first surface of the substrate;
- a plurality of electrode pads on a second surface, different from the first surface, of the substrate, the plurality of electrode pads comprising a first electrode pad and a second electrode pad;
- and
- an electrostatic discharge protection pad overlapping a portion of the first electrode pad and a portion of the second electrode pad.
2 more elements
A semiconductor chip package comprising:
- a substrate;
- a semiconductor chip mounted on a first surface of the substrate;
- a plurality of electrode pads on a second surface, different from the first surface, of the substrate, the plurality of electrode pads comprising a first electrode pad and a second electrode pad;
- and
- an electrostatic discharge protection pad in direct contact with a portion the first electrode pad and a portion of the second electrode pad.
2 more elements
Dependencies are inferred from the claim text.