Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element

An integrated circuit comprising:

• a support substrate provided with opposite first and second main surfaces,
• a cavity passing through the support substrate from one of the main surface to the opposite main surface,
• a device with a mobile element formed in said support substrate, wherein the mobile element is included in the cavity, the mobile element having an anchoring node on the first main surface and a maximum displacement area, the anchoring node and the maximum displacement area defining an axis substantially perpendicular to the first and second main surfaces,
• at least one elementary chip arranged on one of the main surfaces and adapted to be electrically linked to the device with a mobile element.