Detachable substrate and processes for fabricating and detaching such a substrate
AssigneeSoitec
InventorMichel Bruel
Life of this patent
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Abstract
The invention relates to a detachable substrate for the electronics, optics or optoelectronics industry, that includes a detachable layer resting on a buried weakened region. This substrate is remarkable in that this buried weakened region consists of a semiconductor material that is denser in the liquid state than in the solid state and that contains in places precipitates of naturally volatile impurities. The invention also relates to a process for fabricating and detaching a detachable substrate.
Claims20
A process for fabricating a detachable substrate which comprises:
- supplying an intermediate substrate comprising a buried weakenable region made of semiconductor material, doped using naturally volatile impurities, which is denser in the liquid state than in the solid state and a detachable layer that extends from the buried weakenable region to a front side of the substrate;
- and
- locally melting part or all of the weakenable region for weakening to create at least one free surface between the liquefied material of the weakenable region and a volume of gas, recrystallizing the melted portions to form a weakened region that contains in places precipitates of naturally volatile impurities.
A detachable substrate for electronics, optics or optoelectronics applications, comprising a detachable layer terminating at a buried weakened region made of a semiconductor material that is denser in the liquid state than in the solid state and that contains in places precipitates of naturally volatile impurities.
Dependencies are inferred from the claim text.