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US 2012/0074516 A1Published application
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsYoshihiro YAMAGUCHI, Yoshiko OBIRAKI
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Abstract
An object is to provide a semiconductor device having a plate electrode adapted to a plurality of chips, capable of being produced at low cost, and having high heat cycle property. A semiconductor device according to the present invention includes a plurality of semiconductor chips formed on a substrate, and a plate electrode connecting electrodes of the plurality of semiconductor chips. The plate electrode has half-cut portions formed by half-pressing and the raised sides of the half-cut portions are bonded with the electrodes of the semiconductor chips.
Claims8
A semiconductor device comprising:
- a plurality of semiconductor chips formed on a substrate;
- and
- a plate electrode full-cut into a given pattern for connecting electrodes of said plurality of semiconductor chips,
- said plate electrode having half-cut portions formed by half-pressing, raised sides of said half-cut portions being bonded with said electrodes of said semiconductor chips.
1 more element
Dependencies are inferred from the claim text.