Communication device

A communication device, comprising:

• an antenna transmitting/receiving a high frequency signal;
• a semiconductor chip having four corners and four sides processing the high frequency signal;
• and
• a substrate on which a first wiring connected to ground, a second wiring supplying power to the semiconductor chip, a third wiring connected to a protection element or circuit of the semiconductor chip, and fourth wirings transmitting a signal from the semiconductor chip are formed by plating, and the semiconductor chip is mounted,
• wherein the substrate further has a first to fourth substrate main face electrodes formed at front ends of the first to fourth wirings on a substrate main face, which is a semiconductor mounting face, for connecting the first to fourth wirings to the semiconductor chip and a first to fourth substrate rear face electrodes formed at front ends of the first to fourth wirings on a substrate rear face opposite to the semiconductor mounting face for connecting the first to fourth wirings to an external device;
• wherein at least one of the first to third wirings has an extended wiring for plating, which is formed to extend to a substrate edge portion for performing the plating, and at least one of the fourth wirings does not have the extended wiring for plating, which is formed to extend to the substrate edge portion for performing the plating;
• wherein the antenna is disposed to be deviated to one corner among four corners of the semiconductor chip or to one side among four sides of the semiconductor chip from a center portion of the semiconductor chip;
• and
• wherein the extended wiring for plating is formed by extending the first to third wirings to the substrate edge portion at a corner or along a side other than the one corner or the one side.