Light emitting device package and method of manufacturing the same

A light emitting device package comprising:

• a base having a first surface and an opposite second surface, the base forming electrical structures on the first surface and defining at least two through holes which extend through the first and second surfaces;
• a mask arranged on the first surface of the base, a space being defined between the mask and the first surface and communicated with the at least two through holes, and two openings being defined in the mask;
• a light emitting element mounted on the first surface and received in the space, the light emitting element having two pads with reverse polarities received in the two openings respectively;
• two metal wires positioned outside of the mask and electrically connecting the pads and the electrical structures;
• an encapsulating layer filled in the space and encapsulating the light emitting element, the encapsulating layer separated from the metal wires and filling in the at least two through holes of the base, the encapsulating layer comprising phosphors therein;
• and
• a cover layer covering and protecting the mask and the metal wires.

A method of manufacturing a light emitting device package, comprising the following steps:

• A) providing a base, the base having a first surface and an opposite second surface, the base defining at least two through holes extending through the first and second surfaces, and the base having electrical structures formed on the first surface;
• B) mounting a light emitting element on the first surface of the base, the light emitting element having at least one pad on a top surface thereof;
• C) forming a mask on the first surface, the mask covering the light emitting element and defining at least one opening for exposing the at least one pad;
• D) electrically connecting the at least one pad to the electrical structures via at least one metal wire;
• E) filling liquid encapsulating material in a space between the mask and the first surface to form an encapsulating layer that encapsulating the light emitting element, the encapsulating layer being separated from the at least one metal wire and comprising phosphors therein;
• and
• F) forming a cover layer on the first surface to cover and protect the mask and the at least one metal wire.