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US 2012/0074428 A1Published application
Semiconductor module including a switch and non-central diode
AssigneeMitsubishi Electric Corporation
InventorsKiyoshi Arai, Gourab Majumdar
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Abstract
A semiconductor module having one or more silicon carbide diode elements mounted on a switching element is provided in which the temperature rise is reduced by properly disposing each of the diode elements on the switching element, to thereby provide a thermal dissipation path for the respective diode elements. The respective diode elements are arranged on a non-central portion of the switching element, to facilitate dissipation of the heat produced by each of the diode elements, whereby the temperature rise in the semiconductor module is reduced.
Claims3
A semiconductor module, comprising:
- a switching element including a top surface and a bottom surface opposing the top surface;
- and
- a silicon carbide diode element provided on a non-central portion of the top surface of the switching element, a bottom surface of the silicon carbide diode element facing the top surface of the switching element,
- wherein the switching element is rectangular-shaped and the silicon carbide diode element is provided directly on the top surface of the switching element in close proximity to a corner of the switching element.
1 more element
Dependencies are inferred from the claim text.