Soldering preform
AssigneeABB Technology AG
InventorFranc DUGAL
Life of this patent
Estimating the term…
Abstract
A soldering preform for soldering in a reducing atmosphere is substantially disc-shaped and has two soldering surfaces each for being in contact with an object to be soldered, respectively, and with at least one recess on at least one soldering surfaces for constituting a channel open to a surface of the object.
Claims22
A soldering apparatus for soldering in a reducing atmosphere, comprising:
- a substantially disc-shaped preform having two soldering surfaces each for contacting an object to be soldered;
- and
- at least one channel formed into the soldering preform, the at least one channel being open towards at least one of the soldering surfaces and open to a reducing atmosphere when the two soldering surfaces are in contact with objects to be soldered.
A method of soldering using a substantially disc-shaped preform, having two soldering surfaces each for contacting an object to be soldered, and at least one channel formed into the soldering preform, the at least one channel being open towards at least one of the soldering surfaces and open to a reducing atmosphere when the two soldering surfaces are in contact with objects to be soldered, the method comprising:
- placing the preform at a soldering position between two objects to be soldered;
- and
- establishing a reducing atmosphere around a solder joint area by introducing a reducing medium into the at least one channel.
Dependencies are inferred from the claim text.