Integrated resistive heaters for microelectronic devices and methods utilizing the same

A device comprising:

• a. a first portion, the first portion comprising:
• a substrate having a first surface and a second opposing surface;
• and
• at least one electrical connection assembly, wherein each electrical connection assembly comprises:
• a resistive heater disposed on the first surface of the substrate, wherein the resistive heater is electrically connected to a circuit via a heater electrical connection;
• an electrical connection precursor, wherein the electrical connection precursor comprises a fusible conductive material that is electrically connected to a lead;
• and
• a first insulating layer,
• wherein the resistive heater is disposed beneath the electrical connection precursor, wherein the first insulating layer functions to electrically insulate the resistive heater and the heater electrical connection from the electrical connection precursor and the lead, and wherein activation of the resistive heater functions to at least partially melt the fusible conductive material,
• wherein each electrical connection assembly can be activated individually by passing a current through the resistive heater;
• and
• b. a second portion, the second portion comprising:
• an active device;
• and a device contact pad electrically connected to the active device,
• wherein the device contact pad of the second portion and the fusible conductive material of the first portion are electrically and physically connected affording electrical control of the active device through the first portion of the device.

A method of electrically and physically connecting two portions of a device, the method comprising the steps of:

• a. placing a first portion of the device in proximity with a second portion of the device, wherein the first portion comprises:
• a substrate having a first surface and a second opposing surface;
• and
• at least one electrical connection assembly, wherein each electrical connection assembly comprises:
• a resistive heater disposed on the first surface of the substrate, wherein the resistive heater is electrically connected to a circuit via a heater electrical connection;
• an electrical connection precursor, wherein the electrical connection precursor comprises a fusible conductive material that is electrically connected to a lead;
• and
• a first insulating layer,
• wherein the resistive heater is disposed beneath the electrical connection precursor, wherein the first insulating layer functions to electrically insulate the resistive heater and the heater electrical connection from the electrical connection precursor and the lead, and wherein activation of the resistive heater functions to at least partially melt the fusible conductive material,
• wherein each electrical connection assembly can be activated individually by passing a current through the resistive heater;
• and
• the second portion comprises:
• an active device;
• and a device contact pad electrically connected to the active device
• b. passing a current through the resistive heater of the first connection assembly causing the fusible conductive material to at least partially melt;
• and
• c. contacting part of the first portion with part of the second portion to form an electrical and physical connection between the first portion and the second portion to form a device.