Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate

A wiring substrate comprising:

• a substrate body;
• an uppermost layer wiring formed on the substrate body and including a first wiring layer part, wherein the first wiring layer part is independently formed on the substrate body and includes an upper surface, which forms a desired recognition mark, and a side wall;
• and
• an insulation layer formed on the substrate body and the uppermost layer wiring, wherein the insulation layer includes a recess which entirely exposes the upper surface of the first wiring layer part, wherein the insulation layer further includes a lower side wall, which is adjacent to the side wall of the first wiring layer part and surrounds the side wall of the first wiring layer part, and an upper side wall forming part of the recess, and wherein the recess includes a bottom surface that is larger than the upper surface of the first wiring layer part.