Heat exchanger

Abstract

A heat exchanger, in particular for fluid cooling devices, having a package of plane-parallel plates (1), with flow regions (3, 5) for a hot medium and for a cooling medium being formed in alternation between pairs of plates (1) lying on top of one another, said regions each being laterally bordered by profile strips (7, 11) which keep the plates (1) at a distance and which form solder surfaces (25) which adjoin the plates (1), the profile strips (7, 11) on the flow regions (3, 5) of one medium and the other medium extending along edges of the plates (1) abutting one another at an angle and at least the profile strips (11) of the flow regions (5) of the cooling medium having a base body (13), two legs (17) extending from the base body along the solder surfaces (25), and between the legs a recess (15) which is open toward the adjacent flow region (5), is characterized in that the recess (15) at least in the region adjacent to its inner end segment (23) is bordered by planar wall parts (29).

Dependencies are inferred from the claim text.