Adapter Ring For Silicon Electrode
AssigneeMEMC Electronic Materials, Inc.
InventorTerry Parde
Life of this patent
Estimating the term…
Abstract
Methods and systems are provided for retrofitting wafer etching systems. The methods and systems use an adapter ring to retrofit wafer etching systems designed for use with multiple piece electrodes such that single piece electrodes can be used in the etching systems. A portion of the adapter ring is disposed in a receptacle formed in a thermal coupled plate in the wafer etching system. Another portion of the adapter ring is positioned in a channel formed in an upper electrode.
Claims22
A method for retrofitting a wafer etching system comprising:
- positioning an adapter ring in a receptacle formed in a component of the wafer etching system, wherein at least a portion of a first section of the adapter ring is positioned in the receptacle and wherein at least a portion of a second section of the adapter ring protrudes from the receptacle;
- and
- positioning an upper electrode in the system, the upper electrode having a channel formed therein, wherein the upper electrode is positioned in the system such that at least a portion of the second section of the adapter ring is positioned within the channel.
A wafer etching system comprising:
- an etching chamber having at least one receptacle disposed therein;
- an upper electrode positioned within the etching chamber, the upper electrode having a front surface, a back surface, and a channel formed in the back surface;
- and
- an adapter ring having at least a first section and a second section, at least a portion of the first section being configured for placement within the at least one receptacle in the wafer etching device, at least a portion of second section being configured for placement within the channel formed in the back surface of the upper electrode.
A system of components for use in a wafer etching device, the system comprising:
- an adapter ring, at least a portion of the adapter ring being configured for placement within a receptacle in the wafer etching device;
- and
- an electrode having a front surface, a back surface, and a channel formed in the back surface, the channel being configured to receive at least a portion of the second section of the adapter ring therein.
Dependencies are inferred from the claim text.