Embedded printed circuit board and method of manufacturing the same

A method of manufacturing an embedded printed circuit board, comprising:

• (A) forming a first cavity and a third cavity in a first base substrate, disposing a first device in the first cavity, disposing a third device in the third cavity, and fixing the first device and the third device;
• (B) forming a second cavity and a fourth cavity that corresponds to the third cavity in a second base substrate, disposing a second device in the second cavity, and fixing the second device;
• (C) providing an insulating member having a through hole at a position corresponding to the third cavity and the fourth cavity;
• (D) disposing the first base substrate and the second base substrate so that one surface of the first base substrate and one surface of the second base substrate face each other, interposing an insulating member between the one surface of the first base substrate and the one surface of the second base substrate, and pressure laminating the first base substrate, the second base substrate and the insulating member together;
• and
• (E) forming a first copper clad laminate on the other surface of the first base substrate, and forming a second copper clad laminate on the other surface of the second base substrate.