Method of grooving a chemical-mechanical planarization pad

A method of forming chemical-mechanical planarization pad, comprising:

• forming a chemical-mechanical planarization pad including a surface, wherein said chemical-mechanical planarization pad is formed by polymerizing polymer precursors to a selected degree of conversion;
• forming one or more grooves into said surface of said chemical-mechanical planarization pad, wherein said grooves have a first width (W1) and a first depth (D1) and define lands between the grooves;
• and
• thermally treating said chemical-mechanical planarization pad with said grooves formed in said surface, increasing said degree of conversion, and shrinking said lands wherein said grooves exhibit a second width (W2) and a second depth (D2), wherein said second width (W2) is greater than said first width (W1) and said second depth (D2) is greater than said first depth (D1).