Method of manufacturing thermal head

A method of manufacturing a thermal head, comprising:

• forming a groove portion, which is opened in one surface of at least one of a first substrate and a second substrate to be disposed on the first substrate in a stacked state, the first substrate and the second substrate each being of a plate shape;
• measuring a depth dimension of the groove portion formed in the forming of the groove portion;
• bonding the first substrate and the second substrate to each other in the stacked state so as to close an opening of the groove portion formed in the forming of the groove portion;
• thinning the second substrate, which is bonded onto the first substrate in the bonding, to a thickness set based on the depth dimension of the groove portion measured in the measuring;
• and
• forming a heating resistor on a surface of the second substrate, which is thinned in the thinning, in a region opposed to the groove portion.

A method of manufacturing a thermal head, comprising:

• forming a groove portion, which is opened in one surface of at least one of a first substrate and a second substrate to be disposed on the first substrate in a stacked state, the first substrate and the second substrate each being of a plate shape;
• measuring a width dimension and a depth dimension of the groove portion formed in the forming of the groove portion;
• bonding the first substrate and the second substrate to each other in the stacked state so as to close an opening of the groove portion formed in the forming of the groove portion;
• thinning the second substrate, which is bonded onto the first substrate in the bonding, to a thickness set based on the width dimension and the depth dimension of the groove portion measured in the measuring;
• and
• forming a heating resistor on a surface of the second substrate, which is thinned in the thinning, in a region opposed to the groove portion.