Imprinting method, semiconductor integrated circuit manufacturing method and drop recipe creating method
OwnerYasuo MATSUOKA, Ryoichi Inanami +1inventors
InventorsYasuo MATSUOKA, Ryoichi Inanami, Akiko Mimotogi
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Abstract
According to one embodiment, a defect inspection is made on a pattern transferred on substrates to be processed, thereby generating defect image data. When a defect is detected, a defect contour is extracted from the generated image data, the extracted defect contour is reflected on a pattern of the semiconductor integrated circuit and a first drop recipe is generated based on the pattern data on which the defect contour is reflected. A drop recipe used for applying a hardening resin material is updated with the generated first drop recipe.
Claims17
An imprinting method for sequentially applying a hardening resin material on substrates to be processed based on a drop recipe defining an application amount distribution of the hardening resin material, and sequentially transferring a pattern of a semiconductor integrated circuit created on a template onto the substrates to be processed on which the hardening resin material is applied, the method comprising:
- making a defect inspection on the pattern transferred on the substrates to be processed, thereby generating defect image data;
- extracting a defect contour from the generated image data, reflecting the extracted defect contour on pattern data of the semiconductor integrated circuit, and performing a first drop recipe generating processing of generating a first drop recipe based on the pattern data on which the defect contour is reflected;
- and
- updating the drop recipe used for applying the hardening rein material with the generated first drop recipe.
An imprinting method for sequentially applying a hardening resin material on substrates to be processed based on a drop recipe defining an application amount distribution of the hardening resin material, and sequentially transferring a pattern of a semiconductor integrated circuit created on a template onto the substrates to be processed on which the hardening resin material is applied, the method comprising:
- extracting a defect contour from previously-prepared image data of a defect of the template;
- reflecting the extracted defect contour on pattern data of the semiconductor integrated circuit;
- generating a drop recipe based on the pattern data on which the defect contour is reflected;
- and
- setting the generated drop recipe as a drop recipe used for applying the hardening resin material.
A semiconductor integrated circuit manufacturing method for sequentially applying a hardening resin material on substrates to be processed based on a drop recipe defining an application amount distribution of the hardening rein material, and sequentially transferring a pattern of a semiconductor integrated circuit created on a template onto the substrates to be processed on which the hardening resin material is applied, the method comprising:
- making a defect inspection on the pattern transferred on the substrates to be processed, thereby generating defect image data;
- extracting a defect contour from the generated image data, reflecting the extracted defect contour on pattern data of the semiconductor integrated circuit and performing a first drop recipe generating processing of generating a first drop recipe based on the pattern data on which the defect contour is reflected;
- and
- updating the drop recipe used for applying the hardening resin material with the generated first drop recipe.
A semiconductor integrated circuit manufacturing method for sequentially applying a hardening resin material on substrates to be processed based on a drop recipe defining an application amount distribution of the hardening resin material, and sequentially transferring a pattern of a semiconductor integrated circuit created on a template onto the substrates to be processed on which the hardening resin material is applied, thereby manufacturing the semiconductor integrated circuit, the method comprising:
- extracting a defect contour from previously-prepared image data of a defect of the template;
- reflecting the extracted defect contour on pattern data of the semiconductor integrated circuit;
- generating a drop recipe based on the pattern data on which the defect contour is reflected;
- and
- setting the generated drop recipe as a drop recipe used for applying the hardening resin material.
A drop recipe creating method for extracting a defect contour from previously-prepared image data of a defect of a template, reflecting the extracted defect contour on previously-prepared pattern data of the semiconductor integrated circuit, and creating a drop recipe defining an application amount distribution of a hardening resin material based on the pattern data on which the defect contour is reflected.
Dependencies are inferred from the claim text.