Vaporizing and feed apparatus and vaporizing and feed method
AssigneeElpida Memory, Inc.
InventorHiroyuki ODE
Life of this patent
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Abstract
A vaporizing and feed apparatus for vaporizing and feeding a solid film-forming raw material comprises a supercritical fluid feeding part for producing and feeding a supercritical fluid, a supercritical fluid adjusting part for dissolving the solid film-forming raw material in the supercritical fluid by bringing the supercritical fluid fed from the supercritical fluid feeding part into contact with the solid film-forming raw material, and a vaporizing part for phase-transitioning the supercritical fluid having the dissolved solid film-forming raw material to a gas, the solid film-forming raw material thereby being deposited in the gas, and for vaporizing the deposited solid film-forming raw material.
Claims18
A vaporizing and feed apparatus for vaporizing and feeding a solid film-forming raw material, the apparatus comprising:
- a supercritical fluid feeding part for producing and feeding a supercritical fluid;
- a supercritical fluid adjusting part for dissolving the solid film-forming raw material in the supercritical fluid by bringing the supercritical fluid fed from the supercritical fluid feeding part into contact with the solid film-forming raw material;
- and
- a vaporizing part for phase-transitioning the supercritical fluid having the dissolved solid film-forming raw material to a gas, the solid film-forming raw material thereby being deposited in the gas, and for vaporizing the deposited solid film-forming raw material.
A vaporizing and feed method for vaporizing and feeding a solid film-forming raw material, comprising:
- producing a supercritical fluid;
- dissolving the solid film-forming raw material in the supercritical fluid by bringing the supercritical fluid into contact with the solid film-forming raw material;
- and
- phase-transitioning the supercritical fluid having the dissolved solid film-forming raw material to a gas, to deposit the solid film-forming raw material in the gas, and vaporizing the deposited solid film-forming raw material.
A film-forming method using a film-forming apparatus comprising a first chamber, a second chamber and medium feeding equipment, the method comprising:
- accommodating a substrate in the first chamber so that a surface of the substrate that is to be film-formed is turned downward in a vertical direction;
- feeding a medium to the first chamber from the medium feeding equipment in a state in which the medium is in a supercritical state, and is set to a temperature equal to or higher than a critical temperature and lower than a film-forming reaction temperature;
- mixing a film-forming raw material with the supercritical medium fed to the first chamber after increasing a temperature of the substrate to a temperature or higher at which a film-forming reaction is produced;
- and
- reducing a pressure in the first chamber to a pressure lower than the critical pressure of the medium by communicating the first chamber with the second chamber, simultaneously with shutting down the heating of the substrate and the feeding of the medium to the first chamber, after a film having a prescribed thickness is formed on the surface to be film-formed.
Dependencies are inferred from the claim text.