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US 2012/0070135 A1Published application
Apparatus for annealing, method for annealing, and method for manufacturing a semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorTakayuki Ito
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Abstract
An apparatus for annealing a substrate includes a substrate stage having a substrate mounting portion configured to mount the substrate; a heat source having a plurality of heaters disposed under the substrate mounting portion, the heaters individually preheating a plurality areas defined laterally in the substrate through a bottom surface of the substrate; and a light source facing a top surface of the substrate, configured to irradiate a pulsed light at a pulse width of about 0.1 ms to about 100 ms on the entire top surface of the substrate.
Claims7
An apparatus for annealing a substrate, comprising:
- a substrate stage having a substrate mounting portion configured to mount the substrate;
- a heat source having a plurality of heaters disposed under the substrate mounting portion, the heaters individually preheating a plurality of areas defined laterally in the substrate through a bottom surface of the substrate;
- and
- a light source facing a top surface of the substrate, configured to irradiate a pulsed light at a pulse width of about 0.1 ms to about 100 ms on the entire top surface of the substrate.
1 more element
-20. (canceled)
Dependencies are inferred from the claim text.