Illumination system and method of manufacturing multi-chip package structure for light emitting diodes

A manufacturing method of a multichip package structure for a light emitting diode, characterized by comprising:

• providing a silicon substrate comprising a light-emitting chip carrying section and a passive component carrying section;
• forming an insulation layer on the silicon substrate;
• forming a patterned conducting layer on the light-emitting chip carrying section;
• attaching the passive component or forming the passive component by a semiconductor process on the passive component carrying section;
• and
• electrically connecting each of the light-emitting chips arranged in a rhomboidal shape to the patterned conducting layer and the passive component to form a direct current power type or an alternating current power type package structure.

A manufacturing method of a multichip package structure for a light emitting diode, characterized by comprising:

• providing a silicon substrate comprising a light-emitting chip carrying section and a passive component carrying section;
• forming an insulation layer on the silicon substrate;
• forming a patterned conducting layer on the light-emitting chip carrying section;
• attaching the passive component or forming the passive component by a semiconductor process on the passive component carrying section;
• and
• electrically connecting each of the light-emitting chips arranged in a rhomboidal shape to the conductive pattern and the passive component to form a direct current power type or an alternating current power type package structure;
• and
• providing a reflector surrounding the light-emitting chips, wherein the light-emitting chips are arranged so that sides of the light-emitting chips facing towards the reflector.