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US 2012/0068364 A1Published application
Device and Method for Manufacturing a Device
AssigneeInfineon Technologies AG
InventorsManfred Mengel, Joachim Mahler, Khalil Hosseini
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Abstract
A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the first material.
Claims25
A device, comprising:
- a semiconductor material having a first surface;
- a first material applied to the first surface;
- and
- a fiber material embedded in the first material.
1 more element
A device, comprising:
- a semiconductor chip having a first surface;
- and
- a first layer completely covering the first surface, wherein the first layer comprises a solder material and a fiber material embedded in the solder material.
A device, comprising:
- a carrier;
- a semiconductor chip arranged over the carrier;
- an adhesive layer arranged between the carrier and the semiconductor chip;
- and
- a fiber material embedded in the adhesive layer.
2 more elements
A method for manufacturing a device, the method comprising:
- applying a first material to a first surface of a semiconductor material;
- and
- applying a fiber material to the first surface, wherein the first material and the fiber material are applied to the first surface in such a way that the fiber material is embedded in the first material.
A method for manufacturing a device, comprising:
- applying a first material to a first surface of a semiconductor wafer;
- applying a fiber material to the first surface, wherein the first material and the fiber material are applied to the first surface in such a way that the fiber material is embedded in the first material;
- dicing the semiconductor wafer into multiple semiconductor chips;
- and
- arranging at least one of the semiconductor chips over a carrier such that the first material is arranged between the carrier and the semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.