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US 2012/0068342 A1Published application
Electrically conductive adhesive for temporary bonding
OwnerKevin J. Leeinventor
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Abstract
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from electrical charge build-up on the microelectronic devices during the formation of through-silicon vias.
Claims19
A method of fabricating through-silicon vias, comprising:
- providing a microelectronic wafer having an active surface and an opposing back surface;
- and
- adhering the microelectronic wafer active surface to a temporary carrier with a conductive adhesive material.
An intermediate structure comprising:
- a microelectronic wafer having an active surface;
- a temporary carrier;
- and
- a conductive adhesive material adhering the microelectronic device active surface to the temporary carrier.
1 more element
Dependencies are inferred from the claim text.