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US 2012/0068302 A1Published application
Electronic device and method for direct mounting of passive components
AssigneeTexas Instruments Deutschland GmbH
InventorsStefan Beierke, Johann Gross
Life of this patent
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Abstract
An electronic device including a semiconductor die, which has a top surface that is configured to operate as a printed circuit board so as to provide connections for at least one passive component, in particular a passive surface mounted device (SMD).
Claims16
An electronic device comprising a semiconductor die, which has a top surface that is configured to operate as a printed circuit board so as to provide connections for at least one passive component.
A method for manufacturing a half duplex radio frequency transponder, the method comprising:
- manufacturing a die including an integrated electronic circuit to be operated in the half duplex transponder;
- defining areas of an upper metal layer of the semiconductor die in order to operate as pads for being connected to contacts of at least one of a passive capacitor and a passive inductor;
- manufacturing the semiconductor die in accordance with the defined metal areas.
A method for forming an electronic circuit comprising:
- forming an integrated circuit having a metal top layer configured for accepting a passive component;
- and
- attaching the passive component directly to the metal top layer to form a circuit.
Dependencies are inferred from the claim text.